Heat Activation Hot Melt Adhesive Tape For Chip Modules Embedded Substrate

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Shenzhen Tunsing Plastic Products Co., Ltd.

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City: Shenzhen

Province/State: Guangdong

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Heat Activation Hot Melt Adhesive Tape For Chip Modules Embedded Substrate

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Heat Activation Hot Melt Adhesive Tape For Chip Modules Embedded Substrate

Heat Activation Hot Melt Adhesive Tape for Chip Modules Embedded PC / PVC /ABS Substrate Physical Characteristics: Color transparent Release liner Glassine release paper Density 1.2±0.02g/cm³ ...

Product Tags:

55μm Hot Melt Adhesive Tape

200m Hot Melt Adhesive Tape

Heat Activation Thermal Adhesive Tape

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